The latest reports on the upcoming flagship phone of Apple, the iPhone 6, involve a new patent that gives way to a sim card design made smaller.

Inrumor.com wrote about an application of a new patent that describes a process which makes the SIM card be connected to the logic board of the iPhone be smaller; hence letting the smartphone way thinner than the usual. With the more recent speculations that the Apple iPhone 6 will be released in a thinner model, even thinner than the iPhone 5s, then there is high chance for this fresh mechanism to come true too.

A part of the actual mentioned patent statement can be found below:

"The electronic device may also include a circuit board having a top surface, a bottom surface, and a pocket through the top surface that may expose a middle surface of the circuit board between the top surface and the bottom surface. In other embodiments, there is provided a circuit board that may include a top surface, a bottom surface, and a middle surface positioned between the top surface and the bottom surface..."

Meanwhile, in an IBTimes article, it was mentioned how Apple CEO Tim Cook gave hints on how mobile mode payments can be done much conveniently with the iPhone 6. It was with Time that Mr Cook emphasized the huge opportunity waiting for their next flagship phone to tap. Given that they would consider the number of customers who get involved in a lot of e-commerce with the help of their iOS devices.

On other iPhone 6 news, The News Reports wrote about how customers interested to buy the next generation Apple and Samsung phones can avail of a $50 discount by Best Buy. However, they require that the users would sign up this month preferably on or before February 15, 2014.