As flash drives continue to falter, Toshiba announced its new memory chip called BiCS3, a 512 GB 3D flash memory chips. Toshiba is now shipping the memory chips out to the manufacturers all over the world. The production of the memory chips began earlier in February and will expand its production second half this year.

Toshiba BiCS3 512GB 3D Flash was first announced back in July 2016 and has only entered limited production with Toshiba partner Western Digital. The reason why Toshiba's 3D memory is capable of large-scale storage is because BiCS3 chips stack the cells vertically. The 512 GB chips have a result of 64 GB of storage space that could mean larger capacity in much smaller form-factor storage solution soon.

A lot of companies have now been working and developing the same 3D memory solutions but Toshiba's laying claim to being the highest capacity appearing in just smallest footprint. Company's 64-layer design of Toshiba BiCS3 512GB 3D Flash will represent a 65 percent increase in its capacity per unit chip than the previous 48-layer 156GB designs, Digital Trend has reported.

The reports claimed that several of the first devices to have benefited from Toshiba BiCS3 512GB 3D Flash is obviously Toshiba's own SSDs. The reports further claimed that BGA line will feature over 16 of Toshiba's chips that are expected to see usage in some small-scale PCs, offering 1 TB of storage space, and to some lightweight laptops. Anandtech reported that the sample of Toshiba's chips will begin shipping out this coming April.

Toshiba BiCS3 512GB 3D Flash is a wide-reaching ramification for today's industry as the flash memories are widely used now in every small-form-factor devices that also requires onboard storage. Almost all of the devices like tablets, USB-drive, smartphones, games consoles and other will surely make use of this.

Reports claimed that in the near future, a reduction of footprint, adding of greater capacity to a single memory chip to a greater storage space in upcoming devices. These all means that a smaller and leaner hardware is coming in the near future.

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